Issued Patents 2019
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515921 | Semiconductor package and method of fabricating semiconductor package | Chen-Hua Yu, Chun-Hui Yu | 2019-12-24 |
| 10515942 | Semiconductor device and method of manufacturing | Jui Hsieh Lai, Ying-Hao Kuo | 2019-12-24 |
| 10510717 | Chip on package structure and method | Chen-Hua Yu, Der-Chyang Yeh, Jui-Pin Hung | 2019-12-17 |
| 10510707 | Thermally conductive molding compound structure for heat dissipation in semiconductor packages | Chun-Hao Tseng, Ying-Hao Kuo | 2019-12-17 |
| 10510695 | Package structure and method of forming the same | Chen-Hua Yu, Chun-Hui Yu | 2019-12-17 |
| 10490492 | Method for forming semiconductor package using carbon nano material in molding compound | Chun-Hao Tseng, Ying-Hao Kuo | 2019-11-26 |
| 10475747 | Integrated fan-out package and method for fabricating the same | Chen-Hua Yu, Chun-Hui Yu | 2019-11-12 |
| 10461034 | Package structure and manufacturing method thereof | Kai-Chiang Wu, Chen-Hua Yu | 2019-10-29 |
| 10431738 | Integrated fan-out package and method for fabricating the same | Chen-Hua Yu | 2019-10-01 |
| 10373931 | Semiconductor package structure and method of manufacturing the same | Jeng-Nan Hung, Chun-Hui Yu, Yi-Da Tsai, Wei-Hung Lin, Ming-Da Cheng +1 more | 2019-08-06 |
| 10368442 | Integrated circuit structure and method of forming | Chen-Hua Yu, Jui-Pin Hung | 2019-07-30 |
| 10354983 | Integrated circuit package and methods of forming same | Chen-Hua Yu, Mirng-Ji Lii, Chien-Hsun Lee, Jiun Yi Wu | 2019-07-16 |
| 10340249 | Semiconductor device and method | Chen-Hua Yu, Chun-Hui Yu | 2019-07-02 |
| 10325879 | Fan-out stacked system in package (SIP) and the methods of making the same | Chen-Hua Yu | 2019-06-18 |
| 10290611 | Semiconductor packages and methods of forming same | Chen-Hua Yu, Chih-Hang Tung | 2019-05-14 |
| 10283473 | Package structure and manufacturing method thereof | Chen-Hua Yu, Chun-Hui Yu | 2019-05-07 |
| 10276471 | Package and method for integration of heterogeneous integrated circuits | Wan-Yu Lee, Chun-Hao Tseng, Jui Hsieh Lai, Tien-Yu Huang, Ying-Hao Kuo | 2019-04-30 |
| 10269694 | Apparatus and method for chip placement and molding | Jui Hsieh Lai, Ying-Hao Kuo | 2019-04-23 |
| 10269851 | Methods and apparatus for sensor module | Chun-Hui Yu | 2019-04-23 |
| 10269674 | Method of manufacturing an integrated fan-out package having fan-out redistribution layer (RDL) to accommodate electrical connectors | Chen-Hua Yu, Hao-Yi Tsai, Tin-Hao Kuo | 2019-04-23 |
| 10177078 | Method for forming chip package structure | Chen-Hua Yu, Chun-Hui Yu | 2019-01-08 |
| 10177082 | Method for forming semiconductor package using carbon nano material in molding compound | Chun-Hao Tseng, Ying-Hao Kuo | 2019-01-08 |
| 10170387 | Temporary bonding scheme | Wan-Yu Lee, Ying-Hao Kuo | 2019-01-01 |