Issued Patents 2019
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515942 | Semiconductor device and method of manufacturing | Ying-Hao Kuo, Kuo-Chung Yee | 2019-12-24 |
| 10508993 | Bio-chip package with waveguide integrated spectrometer | Ying-Hao Kuo | 2019-12-17 |
| 10502894 | Method of making a metal grating in a waveguide and device formed | Ying-Hao Kuo | 2019-12-10 |
| 10459159 | Photonic package and method forming same | Sung-Hui Huang, Tien-Yu Huang, Wen-Cheng Chen, Yushun Lin | 2019-10-29 |
| 10276471 | Package and method for integration of heterogeneous integrated circuits | Wan-Yu Lee, Chun-Hao Tseng, Tien-Yu Huang, Ying-Hao Kuo, Kuo-Chung Yee | 2019-04-30 |
| 10269694 | Apparatus and method for chip placement and molding | Ying-Hao Kuo, Kuo-Chung Yee | 2019-04-23 |
| 10267988 | Photonic package and method forming same | Sung-Hui Huang, Tien-Yu Huang, Wen-Cheng Chen, Yushun Lin | 2019-04-23 |
| 10261248 | Package structure and methods of forming same | Ying-Hao Kuo, Hai-Ching Chen, Tien-I Bao | 2019-04-16 |