Issued Patents 2019
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510909 | Backside-illuminated photodetector structure and method of making the same | Ying-Hao Kuo | 2019-12-17 |
| 10510603 | Conductive vias in semiconductor packages and methods of forming same | Sung-Hui Huang, Hung-Pin Chang, Sao-Ling Chiu, Shang-Yun Hou | 2019-12-17 |
| 10408998 | Method of fabrication polymer waveguide | Chun-Hao Tseng, Hai-Ching Chen, Tien-I Bao | 2019-09-10 |
| 10361323 | Backside-illuminated photodetector structure and method of making the same | Ying-Hao Kuo | 2019-07-23 |
| 10353147 | Etchant and etching process for substrate of a semiconductor device | Ying-Hao Kuo, Hai-Ching Chen, Tien-I Bao | 2019-07-16 |
| 10276471 | Package and method for integration of heterogeneous integrated circuits | Chun-Hao Tseng, Jui Hsieh Lai, Tien-Yu Huang, Ying-Hao Kuo, Kuo-Chung Yee | 2019-04-30 |
| 10180547 | Optical bench on substrate | Chun-Hao Tseng, Hai-Ching Chen, Tien-I Bao | 2019-01-15 |
| 10170387 | Temporary bonding scheme | Ying-Hao Kuo, Kuo-Chung Yee | 2019-01-01 |