Issued Patents 2019
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515942 | Semiconductor device and method of manufacturing | Jui Hsieh Lai, Kuo-Chung Yee | 2019-12-24 |
| 10510909 | Backside-illuminated photodetector structure and method of making the same | Wan-Yu Lee | 2019-12-17 |
| 10510707 | Thermally conductive molding compound structure for heat dissipation in semiconductor packages | Chun-Hao Tseng, Kuo-Chung Yee | 2019-12-17 |
| 10508993 | Bio-chip package with waveguide integrated spectrometer | Jui Hsieh Lai | 2019-12-17 |
| 10502894 | Method of making a metal grating in a waveguide and device formed | Jui Hsieh Lai | 2019-12-10 |
| 10490492 | Method for forming semiconductor package using carbon nano material in molding compound | Chun-Hao Tseng, Kuo-Chung Yee | 2019-11-26 |
| 10361323 | Backside-illuminated photodetector structure and method of making the same | Wan-Yu Lee | 2019-07-23 |
| 10353147 | Etchant and etching process for substrate of a semiconductor device | Wan-Yu Lee, Hai-Ching Chen, Tien-I Bao | 2019-07-16 |
| 10276471 | Package and method for integration of heterogeneous integrated circuits | Wan-Yu Lee, Chun-Hao Tseng, Jui Hsieh Lai, Tien-Yu Huang, Kuo-Chung Yee | 2019-04-30 |
| 10269694 | Apparatus and method for chip placement and molding | Jui Hsieh Lai, Kuo-Chung Yee | 2019-04-23 |
| 10261248 | Package structure and methods of forming same | Jui Hsieh Lai, Hai-Ching Chen, Tien-I Bao | 2019-04-16 |
| 10177082 | Method for forming semiconductor package using carbon nano material in molding compound | Chun-Hao Tseng, Kuo-Chung Yee | 2019-01-08 |
| 10170387 | Temporary bonding scheme | Wan-Yu Lee, Kuo-Chung Yee | 2019-01-01 |