CT

Chun-Hao Tseng

TSMC: 6 patents #323 of 3,065Top 15%
HT Htc: 5 patents #10 of 219Top 5%
Overall (2019): #6,386 of 560,194Top 2%
12
Patents 2019

Issued Patents 2019

Showing 1–12 of 12 patents

Patent #TitleCo-InventorsDate
10510707 Thermally conductive molding compound structure for heat dissipation in semiconductor packages Ying-Hao Kuo, Kuo-Chung Yee 2019-12-17
10490492 Method for forming semiconductor package using carbon nano material in molding compound Ying-Hao Kuo, Kuo-Chung Yee 2019-11-26
10440841 Electronic device Shih-Po Chien, Yi-Ting Liu, Yu-Jing Liao, I-Cheng Chuang, Chi-Jer Wang +1 more 2019-10-08
10434196 Multivalent saccharide complex, radioactive multivalent saccharide complex contrast agent, and use thereof Hung-Man Yu, Wuu-Jyh Lin, Mei-Hui Wang 2019-10-08
10408998 Method of fabrication polymer waveguide Wan-Yu Lee, Hai-Ching Chen, Tien-I Bao 2019-09-10
10393600 Portable electronic device and sensing method thereof Yu-Jing Liao, Shih-Po Chien, Yi-Ting Liu 2019-08-27
10387708 Physiological characteristic identifying module Shih-Po Chien, Chi-Jer Wang 2019-08-20
10276471 Package and method for integration of heterogeneous integrated circuits Wan-Yu Lee, Jui Hsieh Lai, Tien-Yu Huang, Ying-Hao Kuo, Kuo-Chung Yee 2019-04-30
10275631 Electronic device and physiological characteristic identifying module Shih-Po Chien, Chi-Jer Wang 2019-04-30
10275065 Multi-sensing system, portable electronic device and touch-sensing method Yi-Ting Liu, Shih-Po Chien, Chin-Kuei Wen, Jui-Liang Chen, Yu-Jing Liao +2 more 2019-04-30
10180547 Optical bench on substrate Wan-Yu Lee, Hai-Ching Chen, Tien-I Bao 2019-01-15
10177082 Method for forming semiconductor package using carbon nano material in molding compound Ying-Hao Kuo, Kuo-Chung Yee 2019-01-08