Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510603 | Conductive vias in semiconductor packages and methods of forming same | Hung-Pin Chang, Sao-Ling Chiu, Shang-Yun Hou, Wan-Yu Lee | 2019-12-17 |
| 10459159 | Photonic package and method forming same | Jui Hsieh Lai, Tien-Yu Huang, Wen-Cheng Chen, Yushun Lin | 2019-10-29 |
| 10340242 | Semiconductor device and method of manufacturing the same | Kuan-Yu Huang, Tzu-Kai Lan, Shou-Chih Yin, Shu-Chia Hsu, Pai Yuan Li +2 more | 2019-07-02 |
| 10276532 | Three-dimensional chip stack and method of forming the same | Wei-Ming Chen, Cheng-Hsien Hsieh, Kuo-Ching Hsu | 2019-04-30 |
| 10267988 | Photonic package and method forming same | Jui Hsieh Lai, Tien-Yu Huang, Wen-Cheng Chen, Yushun Lin | 2019-04-23 |