Issued Patents 2019
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510654 | Dummy metal with zigzagged edges | Hsien-Wei Chen, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Li-Han Hsu +1 more | 2019-12-17 |
| 10504877 | Surface mount device/integrated passive device on package or device structure and methods of forming | Hsien-Wei Chen, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Wei-Cheng Wu | 2019-12-10 |
| 10504751 | Package structures and method of forming the same | Hsien-Wei Chen, Li-Han Hsu, Lai Wei Chih | 2019-12-10 |
| 10475768 | Redistribution layers in semiconductor packages and methods of forming same | Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu +1 more | 2019-11-12 |
| 10416566 | Optimization of source and bandwidth for new and existing patterning devices | Willard E. Conley, Wei-An Hsieh, Tsann-Bim Chiou | 2019-09-17 |
| 10319681 | Dummy features in redistribution layers (RDLS) and methods of forming same | Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu +1 more | 2019-06-11 |
| 10290584 | Conductive vias in semiconductor packages and methods of forming same | Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu +1 more | 2019-05-14 |
| 10276532 | Three-dimensional chip stack and method of forming the same | Wei-Ming Chen, Sung-Hui Huang, Kuo-Ching Hsu | 2019-04-30 |
| 10269584 | 3D packages and methods for forming the same | Tzu-Wei Chiu, Hsien-Pin Hu, Kuo-Ching Hsu, Shang-Yun Hou, Shin-Puu Jeng | 2019-04-23 |
| 10269738 | Semiconductor device and method of manufacture | Hsien-Wei Chen, Chen-Hua Yu, Tsung-Shu Lin, Wei-Cheng Wu | 2019-04-23 |