WW

Wei-Cheng Wu

TSMC: 34 patents #11 of 3,065Top 1%
PI Pro-Iroda Industries: 3 patents #1 of 4Top 25%
📍 Hsinchu, DE: #1 of 2 inventorsTop 50%
Overall (2019): #547 of 560,194Top 1%
37
Patents 2019

Issued Patents 2019

Showing 1–25 of 37 patents

Patent #TitleCo-InventorsDate
10516026 Split gate memory device and method of fabricating the same Chang-Ming Wu, Shih-Chang Liu, Harry-Hak-Lay Chuang, Chia-Shiung Tsai 2019-12-24
10515977 Boundary design to reduce memory array edge CMP dishing effect Chien-Hung Chang 2019-12-24
10515829 Package system for integrated circuits Shang-Yun Hou, Shin-Puu Jeng, Chen-Hua Yu 2019-12-24
10510674 Fan-out package having a main die and a dummy die, and method of forming Yan-Fu Lin, Chen-Hua Yu, Meng-Tsan Lee, Hsien-Wei Chen 2019-12-17
10510654 Dummy metal with zigzagged edges Cheng-Hsien Hsieh, Hsien-Wei Chen, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh +1 more 2019-12-17
10510855 Transistor layout to reduce kink effect Meng-Han Lin, Te-Hsin Chiu 2019-12-17
10510763 Embedded nonvolatile memory and forming method thereof Chang-Ming Wu, Yuan-Tai Tseng, Shih-Chang Liu, Chia-Shiung Tsai, Ru-Liang Lee +1 more 2019-12-17
10504877 Surface mount device/integrated passive device on package or device structure and methods of forming Cheng-Hsien Hsieh, Hsien-Wei Chen, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh 2019-12-10
D868857 Torch 2019-12-03
10490460 Semiconductor arrangement and method of forming Harry-Hak-Lay Chuang, Chin-Yi Huang, Shih-Chang Liu 2019-11-26
10475805 Nitride-free spacer or oxide spacer for embedded flash memory Jui-Tsung Lien 2019-11-12
10475768 Redistribution layers in semiconductor packages and methods of forming same Cheng-Hsien Hsieh, Li-Han Hsu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu +1 more 2019-11-12
10468410 Metal gate modulation to improve kink effect Meng-Han Lin, Te-Hsin Chiu 2019-11-05
RE47709 Forming grounded through-silicon vias in a semiconductor substrate Chi-Chun Hsieh, Hsiao-Tsung Yen, Hsien-Pin Hu, Shang-Yun Hou, Shin-Puu Jeng 2019-11-05
10461036 Multi-stacked package-on-package structures Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Ming-Shih Yeh 2019-10-29
10453932 Semiconductor structure for flash memory cells and method of making same Ming Chyi Liu, Chang-Ming Wu, Shih-Chang Liu, Harry-Hak-Lay Chuang, Chia-Shiung Tsai +1 more 2019-10-22
D863910 Hand-held tool 2019-10-22
10453813 Contact pad for semiconductor device Chang-Chia Huang, Tsung-Shu Lin, Cheng-Chieh Hsieh 2019-10-22
10418361 Circuit incorporating multiple gate stack compositions Po-Nien Chen, Bao-Ru Young, Chi-Hsun Hsieh, Harry-Hak-Lay Chuang, Eric Huang 2019-09-17
D859109 Soldering bit 2019-09-10
10381358 Semiconductor device and manufacturing method thereof Jui-Tsung Lien 2019-08-13
10373964 Method of writing to memory circuit using resistive device Yen-Huei Chen, Hung-Jen Liao, Chih-Yu Lin, Jonathan Tsung-Yung Chang 2019-08-06
10354961 Routing design of dummy metal cap and redistribution line Chen-Hua Yu, Hsien-Wei Chen, Meng-Tsan Lee, Tsung-Shu Lin, Chien-Chia Chiu +1 more 2019-07-16
10347649 Nitride-free spacer or oxide spacer for embedded flash memory Jui-Tsung Lien 2019-07-09
10347606 Devices employing thermal and mechanical enhanced layers and methods of forming same Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin +5 more 2019-07-09