Issued Patents 2019
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522490 | Semiconductor package and method of forming the same | Der-Chyang Yeh, Hsien-Wei Chen, Jie Chen | 2019-12-31 |
| 10515865 | Underfill control structures and method | Ying-Ju Chen, An-Jhih Su, Hsien-Wei Chen, Der-Chyang Yeh, Chen-Hua Yu | 2019-12-24 |
| 10515888 | Semiconductor device and method for manufacturing the same | Kuo-Chiang Ting, Shang-Yun Hou, Tu-Hao Yu, Chia-Hao Hsu, Pin-Tso Lin +1 more | 2019-12-24 |
| 10515867 | Semiconductor structure and manufacturing method thereof | Wensen Hung, Tsung-Shu Lin, Shih-Chang Ku, Tsung-Yu Chen, Hung-Chi Li | 2019-12-24 |
| 10510654 | Dummy metal with zigzagged edges | Cheng-Hsien Hsieh, Hsien-Wei Chen, Chen-Hua Yu, Der-Chyang Yeh, Li-Han Hsu +1 more | 2019-12-17 |
| 10510722 | Semiconductor device and method for manufacturing the same | Weiming Chris Chen, Tu-Hao Yu, Kuo-Chiang Ting, Shang-Yun Hou | 2019-12-17 |
| 10510715 | Semiconductor structure and manufacturing method thereof | Chen-Hua Yu, Der-Chyang Yeh, Hsien-Wei Chen, An-Jhih Su, Tien-Chung Yang | 2019-12-17 |
| 10510556 | Integrated circuit package pad and methods of forming | Hsien-Wei Chen, Chen-Hua Yu, Der-Chyang Yeh, An-Jhih Su, Wei-Yu Chen | 2019-12-17 |
| 10504877 | Surface mount device/integrated passive device on package or device structure and methods of forming | Cheng-Hsien Hsieh, Hsien-Wei Chen, Chen-Hua Yu, Der-Chyang Yeh, Wei-Cheng Wu | 2019-12-10 |
| 10475768 | Redistribution layers in semiconductor packages and methods of forming same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh +1 more | 2019-11-12 |
| 10461009 | 3DIC packaging with hot spot thermal management features | Wensen Hung, Szu-Po Huang, Hsiang-Fan Lee, Kim Hong Chen, Shin-Puu Jeng | 2019-10-29 |
| 10461036 | Multi-stacked package-on-package structures | Chen-Hua Yu, An-Jhih Su, Der-Chyang Yeh, Ming-Shih Yeh, Wei-Cheng Wu | 2019-10-29 |
| 10347606 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin +5 more | 2019-07-09 |
| 10319681 | Dummy features in redistribution layers (RDLS) and methods of forming same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh +1 more | 2019-06-11 |
| 10319699 | Chip package having die structures of different heights | Wen-Hsin Wei, Chen-Hua Yu, Hsien-Pin Hu, Shang-Yun Hou, Weiming Chris Chen | 2019-06-11 |
| 10319683 | Multi-stacked package-on-package structures | Chen-Hua Yu, An-Jhih Su, Der-Chyang Yeh, Ming-Shih Yeh, Wei-Cheng Wu | 2019-06-11 |
| 10304800 | Packaging with substrates connected by conductive bumps | Weiming Chris Chen, Ting-Yu Yeh, Chia-Hsin Chen, Tu-Hao Yu, Kuo-Chiang Ting +1 more | 2019-05-28 |
| 10304801 | Redistribution layers in semiconductor packages and methods of forming same | Li-Hsien Huang, An-Jhih Su, Chen-Hua Yu, Der-Chyang Yeh | 2019-05-28 |
| 10297494 | Raised via for terminal connections on different planes | Chen-Hua Yu, An-Jhih Su, Der-Chyang Yeh, Ming-Shih Yeh, Jing-Cheng Lin +1 more | 2019-05-21 |
| 10297471 | Fan-out structure and method of fabricating the same | Chen-Hua Yu, An-Jhih Su, Der-Chyang Yeh, Hsien-Wei Chen, Wei-Yu Chen | 2019-05-21 |
| 10290584 | Conductive vias in semiconductor packages and methods of forming same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh +1 more | 2019-05-14 |
| 10283375 | Integrated circuit package pad and methods of forming | Hsien-Wei Chen, Chen-Hua Yu, Der-Chyang Yeh, An-Jhih Su, Wei-Yu Chen | 2019-05-07 |
| 10269682 | Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devices | Cheng-Chieh Hsieh, Shin-Puu Jeng, Tsung-Yu Chen, Wensen Hung | 2019-04-23 |
| 10170457 | COWOS structures and method of forming the same | Wei-Ming Chen, Tu-Hao Yu, Kuo-Chiang Ting, Shang-Yun Hou | 2019-01-01 |