Issued Patents 2019
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515865 | Underfill control structures and method | An-Jhih Su, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu, Chen-Hua Yu | 2019-12-24 |
| 10504852 | Three-dimensional integrated circuit structures | Jie Chen, Hsien-Wei Chen | 2019-12-10 |
| 10475760 | Semiconductor device | Jie Chen, Hsien-Wei Chen, Tsung-Yuan Yu | 2019-11-12 |
| 10366953 | Redistribution layer structures for integrated circuit package | Jie Chen, Chen-Hua Yu, Der-Chyang Yeh, Hsien-Wei Chen | 2019-07-30 |
| 10347606 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Tsung-Shu Lin, Chin-Chuan Chang +5 more | 2019-07-09 |
| 10340240 | Mechanisms for forming post-passivation interconnect structure | Hsien-Wei Chen | 2019-07-02 |
| 10325865 | Semiconductor structure and manufacturing method thereof | Hsien-Wei Chen, Ming-Fa Chen | 2019-06-18 |
| 10262952 | Ring structures in device die | Jie Chen, Hsien-Wei Chen | 2019-04-16 |
| 10216371 | Method and electronic apparatus for associating note and calendar event | David Folchi | 2019-02-26 |
| 10181449 | Semiconductor structure | Jie Chen, Hsien-Wei Chen | 2019-01-15 |