Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522480 | Packaging devices and methods of manufacture thereof | Hsien-Wei Chen, Ming-Da Cheng, Wen-Hsiung Lu | 2019-12-31 |
| 10510652 | Method of manufacturing semiconductor device | Hao-Yi Tsai, Chao-Wen Shih, Hung-Yi Kuo, Pi-Lan Chang | 2019-12-17 |
| 10475760 | Semiconductor device | Jie Chen, Ying-Ju Chen, Hsien-Wei Chen | 2019-11-12 |
| 10312204 | System and method for an improved interconnect structure | Hsien-Wei Chen, Hao-Yi Tsai, Mirng-Ji Lii, Chen-Hua Yu | 2019-06-04 |
| 10269904 | Semiconductor structure and manufacturing method thereof | Chen-Hua Yu, Mirng-Ji Lii, Hung-Yi Kuo, Hao-Yi Tsai, Min-Chien Hsiao +1 more | 2019-04-23 |
| 10262964 | Interconnect structures and methods of forming same | Wen-Hsiung Lu, Hsuan-Ting Kuo, Hsien-Wei Chen, Ming-Da Cheng, Chung-Shi Liu | 2019-04-16 |