Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510652 | Method of manufacturing semiconductor device | Tsung-Yuan Yu, Hao-Yi Tsai, Chao-Wen Shih, Hung-Yi Kuo | 2019-12-17 |
| 10276481 | Package structure having a plurality of conductive balls having narrow width for the ball waist | Chen-Shien Chen, Chin-Yu Ku, Hsu-Hsien Chen, Wei-Chih Huang, Chun-Ying Lin +1 more | 2019-04-30 |