CL

Chun-Ying Lin

TSMC: 1 patents #1,597 of 3,065Top 55%
Overall (2019): #510,907 of 560,194Top 95%
1
Patents 2019

Issued Patents 2019

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10276481 Package structure having a plurality of conductive balls having narrow width for the ball waist Pi-Lan Chang, Chen-Shien Chen, Chin-Yu Ku, Hsu-Hsien Chen, Wei-Chih Huang +1 more 2019-04-30