Issued Patents 2019
Showing 1–25 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522526 | LTHC as charging barrier in InFO package formation | Yi-Jen Lai, Lin Chung-Yi, Hsi-Kuei Cheng, Kuo-Chio Liu | 2019-12-31 |
| 10522382 | Method of manufacturing a semiconductor device | Yung-Jean Lu, Ming-Fa Chen, Jao Sheng Huang | 2019-12-31 |
| 10515917 | Bump on pad (BOP) bonding structure in semiconductor packaged device | Yao-Chun Chuang, Chita Chuang, Chen-Cheng Kuo | 2019-12-24 |
| 10515938 | Package on-package (PoP) device with integrated passive device in a via | Ching-Wen Hsiao | 2019-12-24 |
| 10515919 | Bump-on-trace design for enlarge bump-to-trace distance | Sheng-Yu Wu, Tin-Hao Kuo | 2019-12-24 |
| 10510644 | Package structures and methods for forming the same | Ching-Wen Hsiao, Ming-Da Cheng, Chih-Wei Lin, Chih-Hua Chen, Chen-Cheng Kuo | 2019-12-17 |
| 10510734 | Semiconductor packages having dummy connectors and methods of forming same | Hsiu-Jen Lin, Ming-Chih Yew, Ming-Da Cheng, Yi-Jen Lai, Yu-Tse Su +2 more | 2019-12-17 |
| 10510727 | Semiconductor device with discrete blocks | Ching-Wen Hsiao, Wei Sen Chang, Shou-Cheng Hu | 2019-12-17 |
| 10510710 | Bump-on-trace interconnect | Chen-Hua Yu | 2019-12-17 |
| 10510661 | Semiconductor devices and methods of forming the same | Hon-Lin Huang, Chin-Yu Ku, Kuan-Chih Huang, Wei-Li Huang | 2019-12-17 |
| 10504856 | Scheme for connector site spacing and resulting structures | Yu-Feng Chen, Yen-Liang Lin, Tin-Hao Kuo, Sheng-Yu Wu | 2019-12-10 |
| 10483225 | Packaging assembly and method of making the same | Chita Chuang, Yao-Chun Chunag, Tsung-Shu Lin, Chen-Cheng Kuo | 2019-11-19 |
| 10483226 | Semiconductor device and method of forming the same | Chin-Yu Ku, Hon-Lin Huang, Chao-Yi Wang, Chien-Hung Kuo | 2019-11-19 |
| 10468366 | Bonded structures for package and substrate | Ming-Hong Cha, Chen-Cheng Kuo, Tsung-Hsien Chiang, Hao-Juin Liu, Yao-Chun Chuang +1 more | 2019-11-05 |
| 10388622 | Bump structure having a side recess and semiconductor structure including the same | Chih-Horng Chang, Tin-Hao Kuo, Yen-Liang Lin | 2019-08-20 |
| 10388620 | Connector structure and method of forming same | Sheng-Yu Wu, Mirng-Ji Lii, Chita Chuang | 2019-08-20 |
| 10361181 | Packaging mechanisms for dies with different sizes of connectors | Chih-Hua Chen, Ching-Wen Hsiao | 2019-07-23 |
| 10354931 | Packaging mechanisms for dies with different sizes of connectors | Chih-Hua Chen, Ching-Wen Hsiao | 2019-07-16 |
| 10319691 | Solderless interconnection structure and method of forming same | Yu-Wei Lin, Sheng-Yu Wu, Yu-Jen Tseng, Tin-Hao Kuo | 2019-06-11 |
| 10319655 | POP structures with dams encircling air gaps and methods for forming the same | Chen-Hua Yu, Tsung-Ding Wang, Chung-Shi Liu, Jiun Yi Wu | 2019-06-11 |
| 10290697 | Magnetic core inductor semiconductor structure and method | Wei-Li Huang, Chi-Cheng Chen, Hon-Lin Huang, Chien-Chih Chou, Chin-Yu Ku | 2019-05-14 |
| 10290600 | Dummy flip chip bumps for reducing stress | Sheng-Yu Wu, Tin-Hao Kuo, Chita Chuang | 2019-05-14 |
| 10288403 | Single sensor type three-dimensional micro/nano contact trigger measuring probe | Ruijun Li, Zhenying Cheng, Kuangchao Fan | 2019-05-14 |
| 10283471 | Micro-connection structure and manufacturing method thereof | Wen-Hsiung Lu, Chen-En Yen, Cheng-Jen Lin, Chin Wei Kang, Kai Jun Zhan | 2019-05-07 |
| 10276525 | Package structure and method of fabricating the same | Ching-Wen Hsiao, Kuo-Ching Hsu, Mirng-Ji Lii | 2019-04-30 |