Issued Patents 2019
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515915 | Methods of forming connector pad structures, interconnect structures, and structures thereof | Chia-Lun Chang, Chung-Shi Liu, Hsien-Wei Chen, Ming-Da Cheng, Wei-Yu Chen | 2019-12-24 |
| 10512124 | Warpage control in the packaging of integrated circuits | Ming-Da Cheng, Cheng-Ting Chen, Wei-Yu Chen, Chien-Wei Lee, Chung-Shi Liu | 2019-12-17 |
| 10510734 | Semiconductor packages having dummy connectors and methods of forming same | Chen-Shien Chen, Ming-Chih Yew, Ming-Da Cheng, Yi-Jen Lai, Yu-Tse Su +2 more | 2019-12-17 |
| 10475679 | Semiconductor processing boat design with pressure sensor | Ai-Tee Ang, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2019-11-12 |
| 10373941 | Package-on-package structures and methods for forming the same | Kuei-Wei Huang, Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2019-08-06 |
| 10297579 | Package on-package structure with epoxy flux residue | Chen-Hua Yu, Wei-Yu Chen, Kuei-Wei Huang, Ming-Da Cheng, Ching-Hua Hsieh +2 more | 2019-05-21 |
| 10276548 | Semiconductor packages having dummy connectors and methods of forming same | Chen-Shien Chen, Ming-Chih Yew, Ming-Da Cheng, Yi-Jen Lai, Yu-Tse Su +2 more | 2019-04-30 |
| 10276536 | Structure and formation method of chip package with fan-out structure | Hao-Jan Pei, Chih-Chiang Tsao, Wei-Yu Chen, Ming-Da Cheng, Ching-Hua Hsieh +1 more | 2019-04-30 |
| 10269739 | Methods of forming connector pad structures, interconnect structures, and structures thereof | Chia-Lun Chang, Chung-Shi Liu, Hsien-Wei Chen, Ming-Da Cheng, Wei-Yu Chen | 2019-04-23 |