Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10512124 | Warpage control in the packaging of integrated circuits | Ming-Da Cheng, Hsiu-Jen Lin, Wei-Yu Chen, Chien-Wei Lee, Chung-Shi Liu | 2019-12-17 |
CC
Cheng-Ting Chen
Overall (2019): #516,361 of 560,194Top 95%
1
Patents 2019