Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10512124 | Warpage control in the packaging of integrated circuits | Ming-Da Cheng, Hsiu-Jen Lin, Cheng-Ting Chen, Wei-Yu Chen, Chung-Shi Liu | 2019-12-17 |
| 10483396 | Interfacial layer between fin and source/drain region | Chih-Yun Chin, Chii-Horng Li, Hsueh-Chang Sung, Heng-Wen Ting, Roger Tai +5 more | 2019-11-19 |