Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10514728 | Housing for electronic device | Chueh-Pin Ko | 2019-12-24 |
| 10515915 | Methods of forming connector pad structures, interconnect structures, and structures thereof | Chung-Shi Liu, Hsiu-Jen Lin, Hsien-Wei Chen, Ming-Da Cheng, Wei-Yu Chen | 2019-12-24 |
| 10289166 | Housing for electronic device | Chueh-Pin Ko | 2019-05-14 |
| 10269739 | Methods of forming connector pad structures, interconnect structures, and structures thereof | Chung-Shi Liu, Hsiu-Jen Lin, Hsien-Wei Chen, Ming-Da Cheng, Wei-Yu Chen | 2019-04-23 |