Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522526 | LTHC as charging barrier in InFO package formation | Lin Chung-Yi, Hsi-Kuei Cheng, Chen-Shien Chen, Kuo-Chio Liu | 2019-12-31 |
| 10510734 | Semiconductor packages having dummy connectors and methods of forming same | Chen-Shien Chen, Hsiu-Jen Lin, Ming-Chih Yew, Ming-Da Cheng, Yu-Tse Su +2 more | 2019-12-17 |
| 10290590 | Stacked semiconductor device and method of manufacturing the same | Shin-Puu Jeng, Tzu-Jui Fang, Hsi-Kuei Cheng, Chih-Kang Han, Hsien-Wen Liu +1 more | 2019-05-14 |
| 10276548 | Semiconductor packages having dummy connectors and methods of forming same | Chen-Shien Chen, Hsiu-Jen Lin, Ming-Chih Yew, Ming-Da Cheng, Yu-Tse Su +2 more | 2019-04-30 |