Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10290590 | Stacked semiconductor device and method of manufacturing the same | Shin-Puu Jeng, Hsi-Kuei Cheng, Chih-Kang Han, Yi-Jen Lai, Hsien-Wen Liu +1 more | 2019-05-14 |
| 10290605 | Fan-out package structure and method for forming the same | Shin-Puu Jeng, Hsien-Wen Liu, Po-Yao Chuang, Yi-Jou Lin | 2019-05-14 |