Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522526 | LTHC as charging barrier in InFO package formation | Yi-Jen Lai, Lin Chung-Yi, Chen-Shien Chen, Kuo-Chio Liu | 2019-12-31 |
| 10290530 | Info structure with copper pillar having reversed profile | Ching Fu Chang, Chih-Kang Han, Hsin-Chieh Huang | 2019-05-14 |
| 10290590 | Stacked semiconductor device and method of manufacturing the same | Shin-Puu Jeng, Tzu-Jui Fang, Chih-Kang Han, Yi-Jen Lai, Hsien-Wen Liu +1 more | 2019-05-14 |