Issued Patents 2019
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515899 | Package structure with bump | Ming-Yen Chiu, Ching Fu Chang | 2019-12-24 |
| 10505001 | Semiconductor device and method of forming the same | Chia-Ming Chang, Chi-Wen Liu, Cheng-Chien Li | 2019-12-10 |
| 10504787 | FinFET with sloped surface at interface between isolation structures | Chih-Sheng Li, Chi-Wen Liu | 2019-12-10 |
| 10468504 | Semiconductor device and manufacturing method thereof | Chih-Sheng Li, Chi-Wen Liu | 2019-11-05 |
| 10326006 | FinFET device and fabricating method thereof | Yen-Ming Peng, Chi-Wen Liu, Yi-Ju Hsu, Horng-Huei Tseng | 2019-06-18 |
| 10290530 | Info structure with copper pillar having reversed profile | Hsi-Kuei Cheng, Ching Fu Chang, Chih-Kang Han | 2019-05-14 |
| 10276506 | Integrated fan-out package | Ming-Yen Chiu, Ching Fu Chang | 2019-04-30 |
| 10247392 | Luminous system | Shun-Wen Teng, Shun Wang | 2019-04-02 |
| 10240755 | Optical lens assembly and illumination device comprising the same | Shun Wang, Shun-Wen Teng | 2019-03-26 |
| 10177185 | High dielectric constant dielectric layer forming method, image sensor device, and manufacturing method thereof | Tsung-Han Tsai, Horng-Huei Tseng, Chun-Hao Chou, Kuo-Cheng Lee, Yung-Lung Hsu +1 more | 2019-01-08 |
| 10170430 | Integrated fan-out package and method of fabricating the same | Ming-Yen Chiu, Ching Fu Chang | 2019-01-01 |