Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515899 | Package structure with bump | Ming-Yen Chiu, Hsin-Chieh Huang | 2019-12-24 |
| 10290530 | Info structure with copper pillar having reversed profile | Hsi-Kuei Cheng, Chih-Kang Han, Hsin-Chieh Huang | 2019-05-14 |
| 10276506 | Integrated fan-out package | Ming-Yen Chiu, Hsin-Chieh Huang | 2019-04-30 |
| 10170430 | Integrated fan-out package and method of fabricating the same | Ming-Yen Chiu, Hsin-Chieh Huang | 2019-01-01 |