Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515899 | Package structure with bump | Hsin-Chieh Huang, Ching Fu Chang | 2019-12-24 |
| 10276506 | Integrated fan-out package | Ching Fu Chang, Hsin-Chieh Huang | 2019-04-30 |
| 10170430 | Integrated fan-out package and method of fabricating the same | Ching Fu Chang, Hsin-Chieh Huang | 2019-01-01 |