Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10326006 | FinFET device and fabricating method thereof | Chi-Wen Liu, Hsin-Chieh Huang, Yi-Ju Hsu, Horng-Huei Tseng | 2019-06-18 |
| 10204843 | Interconnect arrangement with stress-reducing structure and method of fabricating the same | Yi-Ruei Lin, Han-Wei Yang, Chen-Chung Lai | 2019-02-12 |