Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10204843 | Interconnect arrangement with stress-reducing structure and method of fabricating the same | Yen-Ming Peng, Han-Wei Yang, Chen-Chung Lai | 2019-02-12 |
YL
Yi-Ruei Lin
Overall (2019): #213,409 of 560,194Top 40%
1
Patents 2019