Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515866 | Systems and methods to enhance passivation integrity | Ying-Chieh Liao, Han-Wei Yang, Kang-Min Kuo, Bor-Zen Tien | 2019-12-24 |
| 10204843 | Interconnect arrangement with stress-reducing structure and method of fabricating the same | Yi-Ruei Lin, Yen-Ming Peng, Han-Wei Yang | 2019-02-12 |