Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522526 | LTHC as charging barrier in InFO package formation | Yi-Jen Lai, Lin Chung-Yi, Hsi-Kuei Cheng, Chen-Shien Chen | 2019-12-31 |
| 10170429 | Method for forming package structure including intermetallic compound | Heng-Chi Huang, Chien-Chen Li, Kuo-Lung Li, Cheng-Liang Cho, Che-Jung Chu | 2019-01-01 |