Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10170429 | Method for forming package structure including intermetallic compound | Heng-Chi Huang, Chien-Chen Li, Kuo-Lung Li, Cheng-Liang Cho, Kuo-Chio Liu | 2019-01-01 |
CC
Che-Jung Chu
Overall (2019): #515,744 of 560,194Top 95%
1
Patents 2019