Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10213986 | Electric connection and method of manufacturing the same | Shih-Kang Lin, Hao-Miao Chang, Mei-Jun Wang, Che-Yu Yeh | 2019-02-26 |
| 10170429 | Method for forming package structure including intermetallic compound | Heng-Chi Huang, Chien-Chen Li, Kuo-Lung Li, Che-Jung Chu, Kuo-Chio Liu | 2019-01-01 |