Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10170429 | Method for forming package structure including intermetallic compound | Heng-Chi Huang, Kuo-Lung Li, Cheng-Liang Cho, Che-Jung Chu, Kuo-Chio Liu | 2019-01-01 |
CL
Chien-Chen Li
Overall (2019): #511,106 of 560,194Top 95%
1
Patents 2019