Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515875 | Interconnect structure for package-on-package devices | Jui-Pin Hung, Jing-Cheng Lin, Po-Hao Tsai, Shuo-Mao Chen, Chiung-Han Yeh +1 more | 2019-12-24 |
| 10354988 | Using metal-containing layer to reduce carrier shock in package formation | Shin-Puu Jeng, Hsien-Wen Liu | 2019-07-16 |
| 10290590 | Stacked semiconductor device and method of manufacturing the same | Shin-Puu Jeng, Tzu-Jui Fang, Hsi-Kuei Cheng, Chih-Kang Han, Yi-Jen Lai +1 more | 2019-05-14 |
| 10290605 | Fan-out package structure and method for forming the same | Shin-Puu Jeng, Hsien-Wen Liu, Po-Yao Chuang, Tzu-Jui Fang | 2019-05-14 |
| 10269685 | Interconnect structure for package-on-package devices | Jui-Pin Hung, Jing-Cheng Lin, Po-Hao Tsai, Shuo-Mao Chen, Chiung-Han Yeh +1 more | 2019-04-23 |