Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515827 | Method for forming chip package with recessed interposer substrate | Shin-Puu Jeng, Po-Hao Tsai, Feng-Cheng Hsu, Shuo-Mao Chen, Techi Wong | 2019-12-24 |
| 10468339 | Heterogeneous fan-out structure and method of manufacture | Po-Hao Tsai, Shin-Puu Jeng, Techi Wong | 2019-11-05 |
| 10347574 | Integrated fan-out packages | Shin-Puu Jeng, Dai-Jang Chen, Hsiang-Tai Lu, Hsien-Wen Liu, Chih-Hsien Lin +1 more | 2019-07-09 |
| 10290605 | Fan-out package structure and method for forming the same | Shin-Puu Jeng, Hsien-Wen Liu, Tzu-Jui Fang, Yi-Jou Lin | 2019-05-14 |