Issued Patents 2019
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515875 | Interconnect structure for package-on-package devices | Jui-Pin Hung, Jing-Cheng Lin, Po-Hao Tsai, Yi-Jou Lin, Chiung-Han Yeh +1 more | 2019-12-24 |
| 10515827 | Method for forming chip package with recessed interposer substrate | Shin-Puu Jeng, Po-Hao Tsai, Po-Yao Chuang, Feng-Cheng Hsu, Techi Wong | 2019-12-24 |
| 10504880 | Method of forming semicondcutor device package | Po-Yao Lin, Cheng-Yi Hong, Feng-Cheng Hsu, Shin-Puu Jeng, Shu-Shen Yeh +1 more | 2019-12-10 |
| 10504752 | Integrated passive device package and methods of forming same | Feng-Cheng Hsu, Jui-Pin Hung, Shin-Puu Jeng | 2019-12-10 |
| 10475731 | Package with metal-insulator-metal capacitor and method of manufacturing the same | Der-Chyang Yeh, Chiung-Han Yeh | 2019-11-12 |
| 10373923 | Package with passive devices and method of forming the same | Der-Chyang Yeh, Li-Hsien Huang | 2019-08-06 |
| 10283474 | Chip package structure and method for forming the same | Shin-Puu Jeng, Feng-Cheng Hsu | 2019-05-07 |
| 10276551 | Semiconductor device package and method of forming semiconductor device package | Po-Yao Lin, Cheng-Yi Hong, Feng-Cheng Hsu, Shin-Puu Jeng, Shu-Shen Yeh +1 more | 2019-04-30 |
| 10276484 | Package with metal-insulator-metal capacitor and method of manufacturing the same | Der-Chyang Yeh, Chiung-Han Yeh | 2019-04-30 |
| 10269685 | Interconnect structure for package-on-package devices | Jui-Pin Hung, Jing-Cheng Lin, Po-Hao Tsai, Yi-Jou Lin, Chiung-Han Yeh +1 more | 2019-04-23 |
| 10269736 | Method of forming metal pads with openings in integrated circuits including forming a polymer extending into a metal pad | Yu-Ting Huang | 2019-04-23 |