Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10504880 | Method of forming semicondcutor device package | Cheng-Yi Hong, Feng-Cheng Hsu, Shuo-Mao Chen, Shin-Puu Jeng, Shu-Shen Yeh +1 more | 2019-12-10 |
| 10276551 | Semiconductor device package and method of forming semiconductor device package | Cheng-Yi Hong, Feng-Cheng Hsu, Shuo-Mao Chen, Shin-Puu Jeng, Shu-Shen Yeh +1 more | 2019-04-30 |
| 10269602 | Wafer warpage inspection system and method using the same | Wen-Yi Lin, Shin-Puu Jeng | 2019-04-23 |