Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515875 | Interconnect structure for package-on-package devices | Jui-Pin Hung, Jing-Cheng Lin, Po-Hao Tsai, Yi-Jou Lin, Shuo-Mao Chen +1 more | 2019-12-24 |
| 10475731 | Package with metal-insulator-metal capacitor and method of manufacturing the same | Shuo-Mao Chen, Der-Chyang Yeh | 2019-11-12 |
| 10403736 | Polysilicon design for replacement gate technology | Harry-Hak-Lay Chuang, Kong-Beng Thei, Sheng-Chen Chung, Lee-Wee Teo, Yu-Ying Hsu +1 more | 2019-09-03 |
| 10276484 | Package with metal-insulator-metal capacitor and method of manufacturing the same | Shuo-Mao Chen, Der-Chyang Yeh | 2019-04-30 |
| 10269685 | Interconnect structure for package-on-package devices | Jui-Pin Hung, Jing-Cheng Lin, Po-Hao Tsai, Yi-Jou Lin, Shuo-Mao Chen +1 more | 2019-04-23 |