Issued Patents 2019
Showing 1–25 of 46 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522496 | Method for a stacked and bonded semiconductor device | Li-Hui Cheng, Po-Hao Tsai | 2019-12-31 |
| 10522476 | Package structure, integrated fan-out package and method of fabricating the same | Li-Hui Cheng, Po-Hao Tsai | 2019-12-31 |
| 10522439 | Semiconductor package device | Nai-Wei Liu, Jui-Pin Hung | 2019-12-31 |
| 10518387 | Grinding element, grinding wheel and manufacturing method of semiconductor package using the same | Yi-Chao Mao, Chin-Chuan Chang, Wen-Hua Chang | 2019-12-31 |
| 10515875 | Interconnect structure for package-on-package devices | Jui-Pin Hung, Po-Hao Tsai, Yi-Jou Lin, Shuo-Mao Chen, Chiung-Han Yeh +1 more | 2019-12-24 |
| 10515901 | InFO-POP structures with TIVs having cavities | Chen-Hua Yu, Po-Hao Tsai | 2019-12-24 |
| 10515937 | Semiconductor device and method of manufacture | Po-Hao Tsai, Li-Hui Cheng, Porter Chen | 2019-12-24 |
| 10515923 | Method for forming semiconductor package structure with twinned copper layer | Jung-Hua Chang, Po-Hao Tsai | 2019-12-24 |
| 10515904 | Method for forming chip package structure | Po-Hao Tsai | 2019-12-24 |
| 10510634 | Package structure and method | Szu-Wei Lu, Chen-Hua Yu | 2019-12-17 |
| 10510732 | PoP device and method of forming the same | Hsien-Ju Tsou, Chih-Wei Wu, Pu Wang, Szu-Wei Lu, Ying-Ching Shih | 2019-12-17 |
| 10510684 | Three dimensional integrated circuit (3DIC) with support structures | Chih-Wei Wu, Ying-Ching Shih, Szu-Wei Lu | 2019-12-17 |
| 10510595 | Integrated fan-out packages and methods of forming the same | Chih-Wei Wu, Ying-Ching Shih, Szu-Wei Lu, Long Hua Lee | 2019-12-17 |
| 10497690 | Semiconductor package, method for forming semiconductor package, and method for forming semiconductor assembly | Hsien-Ju Tsou, Chih-Wei Wu, Pu Wang, Ying-Ching Shih, Szu-Wei Lu | 2019-12-03 |
| 10497616 | Embedded 3D interposer structure | Ying-Ching Shih, Wen-Chih Chiou, Shin-Puu Jeng, Chen-Hua Yu | 2019-12-03 |
| 10490474 | Die-on-interposer assembly with dam structure and method of manufacturing the same | Chih-Wei Wu, Szu-Wei Lu | 2019-11-26 |
| 10483234 | Chip packages and methods of manufacture thereof | Chih-Wei Wu, Szu-Wei Lu, Ying-Ching Shih | 2019-11-19 |
| 10475759 | Integrated circuit structure having dies with connectors of different sizes | Shin-Puu Jeng, Chen-Hua Yu | 2019-11-12 |
| 10461069 | Hybrid bonding with through substrate via (TSV) | — | 2019-10-29 |
| 10438934 | Package-on-package structure and manufacturing method thereof | Shih-Ting Lin, Chin-Fu Kao, Li-Hui Cheng, Szu-Wei Lu | 2019-10-08 |
| 10439042 | Semiconductor device and fabrication method thereof | — | 2019-10-08 |
| 10366960 | Fan-out package and methods of forming thereof | Wan-Ting Shih, Nai-Wei Liu, Cheng-Lin Huang | 2019-07-30 |
| 10361161 | Semiconductor device and method of manufacture | Chen-Hua Yu, Po-Hao Tsai | 2019-07-23 |
| 10354982 | Integrated fan-out structure with guiding trenches in buffer layer | Po-Hao Tsai, Feng-Cheng Hsu, Li-Hui Cheng, Jui-Pin Hung | 2019-07-16 |
| 10347612 | Solution for reducing poor contact in InFO package | Chen-Hua Yu, Szu-Wei Lu, Shih-Ting Lin, Shin-Puu Jeng | 2019-07-09 |