Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510605 | Semiconductor die singulation and structures formed thereby | Fu-Chen Chang, Wen-Ming Chen | 2019-12-17 |
| 10446522 | Methods of forming multiple conductive features in semiconductor devices in a same formation process | Meng-Liang Lin | 2019-10-15 |
| 10366960 | Fan-out package and methods of forming thereof | Wan-Ting Shih, Nai-Wei Liu, Jing-Cheng Lin | 2019-07-30 |
| 10361152 | Semiconductor structure having an air-gap region and a method of manufacturing the same | Shu-Hui Su, Jiing-Feng Yang, Zhen-Cheng Wu, Ren-Guei Wu, Dian-Hau Chen +1 more | 2019-07-23 |