Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522439 | Semiconductor package device | Jui-Pin Hung, Jing-Cheng Lin | 2019-12-31 |
| 10483211 | Fan-out package structure and method for forming the same | Tzu-Hung Lin, I-Hsuan Peng, Ching-Wen Hsiao, Wei-Che Huang | 2019-11-19 |
| 10468341 | Semiconductor package assembly | Tzu-Hung Lin, I-Hsuan Peng, Che-Hung Kuo, Che-Ya Chou, Wei-Che Huang | 2019-11-05 |
| 10366960 | Fan-out package and methods of forming thereof | Wan-Ting Shih, Jing-Cheng Lin, Cheng-Lin Huang | 2019-07-30 |
| 10217723 | Semiconductor package with improved bandwidth | Tzu-Hung Lin, I-Hsuan Peng, Wei-Che Huang | 2019-02-26 |
| 10199318 | Semiconductor package assembly | Tzu-Hung Lin, I-Hsuan Peng, Che-Hung Kuo, Che-Ya Chou, Wei-Che Huang | 2019-02-05 |