Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515887 | Fan-out package structure having stacked carrier substrates and method for forming the same | Shih-Yi Syu, Chia-Yu Jin, Wen-Sung Hsu, Nan-Cheng Chen | 2019-12-24 |
| 10497678 | Semiconductor package assembly with passive device | Che-Hung Kuo, Ying-Chih Chen | 2019-12-03 |
| 10468341 | Semiconductor package assembly | Nai-Wei Liu, Tzu-Hung Lin, I-Hsuan Peng, Che-Hung Kuo, Wei-Che Huang | 2019-11-05 |
| 10224287 | Semiconductor device and wafer level package including such semiconductor device | Shih-Yi Syu, Tung-Hsien Hsieh | 2019-03-05 |
| 10199318 | Semiconductor package assembly | Nai-Wei Liu, Tzu-Hung Lin, I-Hsuan Peng, Che-Hung Kuo, Wei-Che Huang | 2019-02-05 |