| 10515887 |
Fan-out package structure having stacked carrier substrates and method for forming the same |
Shih-Yi Syu, Chia-Yu Jin, Che-Ya Chou, Nan-Cheng Chen |
2019-12-24 |
| 10354974 |
Structure and formation method of chip package structure |
Shih-Chin Lin, Andrew C. Chang, Tao Cheng |
2019-07-16 |
| 10340198 |
Semiconductor package with embedded supporter and method for fabricating the same |
Ta-Jen Yu |
2019-07-02 |
| 10340199 |
Packaging substrate with block-type via and semiconductor packages having the same |
Tai-Yu Chen |
2019-07-02 |
| 10312222 |
Semiconductor package and semiconductor device using the same |
Shih-Chin Lin, Tao Cheng |
2019-06-04 |
| 10242927 |
Semiconductor package, semiconductor device using the same and manufacturing method thereof |
Shih-Chin Lin, Ming-Jen Hsiung |
2019-03-26 |
| 10236242 |
Chip package and package substrate |
Ta-Jen Yu |
2019-03-19 |
| 10236187 |
Semiconductor package and method for fabricating base for semiconductor package |
Ta-Jen Yu |
2019-03-19 |
| 10217716 |
Semiconductor package and method for fabricating the same |
Ta-Jen Yu, Yu-Sheng Hung |
2019-02-26 |
| 10186488 |
Manufacturing method of semiconductor package and manufacturing method of semiconductor device |
Shih-Chin Lin, Tao Cheng, Andrew C. Chang |
2019-01-22 |