Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10242927 | Semiconductor package, semiconductor device using the same and manufacturing method thereof | Wen-Sung Hsu, Shih-Chin Lin | 2019-03-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10242927 | Semiconductor package, semiconductor device using the same and manufacturing method thereof | Wen-Sung Hsu, Shih-Chin Lin | 2019-03-26 |