Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10354974 | Structure and formation method of chip package structure | Wen-Sung Hsu, Andrew C. Chang, Tao Cheng | 2019-07-16 |
| 10312222 | Semiconductor package and semiconductor device using the same | Wen-Sung Hsu, Tao Cheng | 2019-06-04 |
| 10242927 | Semiconductor package, semiconductor device using the same and manufacturing method thereof | Wen-Sung Hsu, Ming-Jen Hsiung | 2019-03-26 |
| 10186488 | Manufacturing method of semiconductor package and manufacturing method of semiconductor device | Wen-Sung Hsu, Tao Cheng, Andrew C. Chang | 2019-01-22 |