Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10354974 | Structure and formation method of chip package structure | Wen-Sung Hsu, Shih-Chin Lin, Andrew C. Chang | 2019-07-16 |
| 10312222 | Semiconductor package and semiconductor device using the same | Wen-Sung Hsu, Shih-Chin Lin | 2019-06-04 |
| 10186488 | Manufacturing method of semiconductor package and manufacturing method of semiconductor device | Wen-Sung Hsu, Shih-Chin Lin, Andrew C. Chang | 2019-01-22 |