Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10340198 | Semiconductor package with embedded supporter and method for fabricating the same | Wen-Sung Hsu | 2019-07-02 |
| 10312210 | Semiconductor package | Ching-Liou Huang | 2019-06-04 |
| 10236187 | Semiconductor package and method for fabricating base for semiconductor package | Wen-Sung Hsu | 2019-03-19 |
| 10236242 | Chip package and package substrate | Wen-Sung Hsu | 2019-03-19 |
| 10217716 | Semiconductor package and method for fabricating the same | Yu-Sheng Hung, Wen-Sung Hsu | 2019-02-26 |