Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515887 | Fan-out package structure having stacked carrier substrates and method for forming the same | Shih-Yi Syu, Che-Ya Chou, Wen-Sung Hsu, Nan-Cheng Chen | 2019-12-24 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515887 | Fan-out package structure having stacked carrier substrates and method for forming the same | Shih-Yi Syu, Che-Ya Chou, Wen-Sung Hsu, Nan-Cheng Chen | 2019-12-24 |