Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515887 | Fan-out package structure having stacked carrier substrates and method for forming the same | Chia-Yu Jin, Che-Ya Chou, Wen-Sung Hsu, Nan-Cheng Chen | 2019-12-24 |
| 10290559 | Thermal dissipation through seal rings in 3DIC structure | Jing-Cheng Lin | 2019-05-14 |
| 10224287 | Semiconductor device and wafer level package including such semiconductor device | Tung-Hsien Hsieh, Che-Ya Chou | 2019-03-05 |