Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10340199 | Packaging substrate with block-type via and semiconductor packages having the same | Wen-Sung Hsu | 2019-07-02 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10340199 | Packaging substrate with block-type via and semiconductor packages having the same | Wen-Sung Hsu | 2019-07-02 |