Issued Patents 2019
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10497689 | Semiconductor package assembly and method for forming the same | Chia-Cheng Chang, Tzu-Hung Lin | 2019-12-03 |
| 10483211 | Fan-out package structure and method for forming the same | Tzu-Hung Lin, Ching-Wen Hsiao, Nai-Wei Liu, Wei-Che Huang | 2019-11-19 |
| 10468341 | Semiconductor package assembly | Nai-Wei Liu, Tzu-Hung Lin, Che-Hung Kuo, Che-Ya Chou, Wei-Che Huang | 2019-11-05 |
| 10424563 | Semiconductor package assembly and method for forming the same | Tzu-Hung Lin, Ching-Wen Hsiao | 2019-09-24 |
| 10410969 | Semiconductor package assembly | Tzu-Hung Lin, Chia-Cheng Chang | 2019-09-10 |
| 10256210 | Semiconductor package structure and method for forming the same | Tzu-Hung Lin, Ching-Wen Hsiao | 2019-04-09 |
| 10217724 | Semiconductor package assembly with embedded IPD | Tzu-Hung Lin, Ching-Wen Hsiao | 2019-02-26 |
| 10217723 | Semiconductor package with improved bandwidth | Tzu-Hung Lin, Nai-Wei Liu, Wei-Che Huang | 2019-02-26 |
| 10199318 | Semiconductor package assembly | Nai-Wei Liu, Tzu-Hung Lin, Che-Hung Kuo, Che-Ya Chou, Wei-Che Huang | 2019-02-05 |
| 10177125 | Semiconductor package assembly | Tzu-Hung Lin, Ching-Wen Hsiao | 2019-01-08 |