Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10497689 | Semiconductor package assembly and method for forming the same | I-Hsuan Peng, Tzu-Hung Lin | 2019-12-03 |
| 10410969 | Semiconductor package assembly | Tzu-Hung Lin, I-Hsuan Peng | 2019-09-10 |